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BOYD - 573300D00010G - Heat Sink, Square, PCB, For D-Pak Devices, 18 °C/W, TO-263, 12.7 mm, 10.16 mm, 26.16 mm
- Thermal Resistance: 18°C/W
- Packages Cooled: TO-263
- External Width - Metric: 12.7mm
- External Height - Metric: 10.16mm
- External Length - Metric: 26.16mm
- External Diameter - Metric: -
- Heat Sink Material: Copper
- External Width - Imperial: 0.5"
- External Height - Imperial: 0.4"
- External Length - Imperial: 1.03"
- External Diameter - Imperial: -
- Product Range: -
- SVHC: No SVHC (15-Jan-2019)
