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FISCHER ELEKTRONIK - ICK BGA 27 X 27 X 10 - Heat Sink, Square, PCB, For Ball Grid Arrays, 18.5 °C/W, BGA, 27 mm, 10 mm, 27 mm
- Thermal Resistance: 18.5°C/W
- Packages Cooled: BGA
- External Width - Metric: 27mm
- External Height - Metric: 10mm
- External Length - Metric: 27mm
- External Diameter - Metric: -
- Heat Sink Material: Aluminium
- External Width - Imperial: 1.06"
- External Height - Imperial: 0.39"
- External Length - Imperial: 1.06"
- External Diameter - Imperial: -
- Product Range: -
- SVHC: No SVHC (15-Jan-2019)
- For Use With: IC design BGA and others