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MULTICOMP - MC001795 - Breadboard, 830 Tie Points, 8.3 mm, 56 mm, 165 mm
- Breadboard Type: Solderless Breadboard
- Total Number of Tie Points: 830Tie Points
- No. of Distribution Strips / Buses: 2Bus Strips
- No. of Terminal Strips: 1 Terminal Strip
- Board Dimensions (L x W) - Imperial: 6.5" x 2.2"
- Board Dimensions (L x W) - Metric: 165mm x 56mm
- SVHC: No SVHC (27-Jun-2018)
- Board Thickness: 8.3mm
- Board Type: Breadboard
- External Depth: 165.1mm
- External Height: 8.3mm
- External Width: 56mm